Rongpeng Liu1, Yingchun Li2, Liqiang Wan3*, Farong Huang4, Lei Du5
Abstract— A novel silicon-containing polytriazole resin with long storage time was prepared from DMSEPE (internal alkynes) and BPDBA (diazide) through thermal 1, 3-dipolar cycloaddition polymerization. The resin was soluble in common solvents such as tetrahydrofuran (THF), chloroform and so on. It was easy to be molded due to the low viscosity of the resin at low temperature. The value of apparent activation energy (Ea) of the curing reaction obtained by Kissinger’s method was 105.0 kJ/mol. The non-isothermal DSC tests showed that this kind of polytriazole resin could be cured at around 100 oC. The glass transition temperature and the temperature of 5% weight loss of the cured resin were 289 and 350 oC, respectively. The storage time of this polytriazole resin was more than 40 days at 35 oC.
Keywords— polytriazole resin, 1,3-dipolar cycloaddition polymerization, internal alkynes, diazide.
Click here to Download Full Paper
AD Publications is a rapidly growing academic publisher in the fields of Engineering, Medical-Health, Environmental Science and Agriculture Research. AD Publications is a registered organization broad-based open access and publishes most exciting researches with respect to the subjects of our journals. The Journals is being indexed and abstracted by all major global current awareness and alerting services.
The organization aims at undertaking, co- coordinating and promoting research and development. It provides professional and academic guidance in the field of basic education, Higher Education as well in the Technical Education. Our Aims is to Promote and support, High Quality basic, Scientific Research and development in fields of Engineering, Medical-Health, Environmental Science and Agriculture Research and to Generate Public awareness, provide advice to scholar’s researchers and communicate research outcomes.
Some Important Links About Research Journal
International Journal
Agriculture Journal
Medical Journal
Environmental Journal
Engineering Journal