Rongpeng Liu1, Yingchun Li2, Liqiang Wan3*, Farong Huang4, Lei Du5
Abstract— A novel silicon-containing polytriazole resin with long storage time was prepared from DMSEPE (internal alkynes) and BPDBA (diazide) through thermal 1, 3-dipolar cycloaddition polymerization. The resin was soluble in common solvents such as tetrahydrofuran (THF), chloroform and so on. It was easy to be molded due to the low viscosity of the resin at low temperature. The value of apparent activation energy (Ea) of the curing reaction obtained by Kissinger’s method was 105.0 kJ/mol. The non-isothermal DSC tests showed that this kind of polytriazole resin could be cured at around 100 oC. The glass transition temperature and the temperature of 5% weight loss of the cured resin were 289 and 350 oC, respectively. The storage time of this polytriazole resin was more than 40 days at 35 oC.
Keywords— polytriazole resin, 1,3-dipolar cycloaddition polymerization, internal alkynes, diazide.
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